Helios G4 PFIB CXe DualBeam for Semiconductors

Highest throughput, highest resolution large area sample preparation and analysis of Advanced Packaging Materials

The Helios G4 PFIB CXe DualBeam™ System provides unique capabilities to enable advanced failure analysis of 3D packages and damage-free delayering of semiconductor devices, in addition to a wide range of other large area FIB processing applications.