Helios G4 PFIB HXe DualBeam for Semiconductors

Highest throughput, highest resolution large area deprocessing, sample preparation and characterization of 10nm devices

The Helios G4 PFIB HXe DualBeam™ System provides unique capabilities to enable damage-free delayering of 10nm semiconductor devices and advanced failure analysis of 3D packages, in addition to a wide range of other large area FIB processing applications.